www.rohm.com
?2013 ROHM Co., Ltd. All rights reserved.
Data Sheet
SML-52 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depend on the condition of the PCB.
Thorough design review is recommended before the final designing
his product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape.
.SOLDERING Sn-Cu Sn-A -Cu Sn-A -Bi-Cu
LED products do not contain reinforcement
materials such as glass fillers.
herefore thermal stress b solderin reatl
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
.HANDLING AFTER MOUNTING
As shown right drawing, in case outside force of around
1kg is given to the device, stress is concentrated to the
jointed part between mold resin and substrate.
Therefore there is a possibility to breat the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
sopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub.
4-4) COOLING
Below 100篊 within 3 minutes.
.EROSION GAS
tilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of
solder strength, optical characteristics, or functions.
Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,
and also after mounted on circuit board.
Min.1 min Max. 40sec
Max.250篊, Within 10sec
140 to 180篊
230 to 260篊
(Fig-1)
(Fig-2)
0.6mm
2.45mm
Outside Force
PCB
Mold
Substrate
Soldering part
Emitting Direction
8/9
2013.09 - Rev.D
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
SML-A12DTT86
LED 611NM ORANGE WTR CLR RA SMD
SML-DSP1210SIC-TR
LED 1.5V SRED WTR CLR 1210 SMD
SML-DSP1210SOC-TR
LED 1.5V ORN WATER CLR 1210 SMD
SML-DSP1210SYC-TR
LED 1.5V YLW WATER CLR 1210 SMD
SML-DSP1210UPGC-TR
LED 1.5V GRN WATER CLR 1210 SMD
SML-DSP1210USBC-TR
LED 1.5V BLUE WTR CLR 1210 SMD
SML-H1505SIC-TR
LED 5MM 635NM SUPRED CL SMD
SML-H1505SIUGUBCTR
LED 5MM RED/GRN/BLU CLR SMD
相关代理商/技术参数
SML-522MY8W
制造商:ROHM 制造商全称:Rohm 功能描述:Abundant 2 color variations
SML-522MY8WT86
功能描述:标准LED-SMD LED Bi-Color Green Yellow RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel
SML60A16
制造商:SEME-LAB 制造商全称:Seme LAB 功能描述:N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS
SML60A18
制造商:SEME-LAB 制造商全称:Seme LAB 功能描述:N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS
SML60B16
制造商:SEME-LAB 制造商全称:Seme LAB 功能描述:N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS
SML60B18
制造商:SEME-LAB 制造商全称:Seme LAB 功能描述:N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS
SML60B21
制造商:SEME-LAB 制造商全称:Seme LAB 功能描述:N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS
SML60B25
制造商:SEME-LAB 制造商全称:Seme LAB 功能描述:N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS